Share:


IRF3500

Specifications

SKU: 11541422

BUY IRF3500 https://www.utsource.net/itm/p/11541422.html

Parameter Symbol Conditions Min Typ Max Unit
Drain-Source On-Resistance RDS(on) VGS = 10V, ID = 20A - 0.075 - Ω
Gate Threshold Voltage VGS(th) ID = 250μA 2.0 - 4.0 V
Continuous Drain Current ID TC = 25°C - 39 - A
TC = 75°C - 26 - A
Pulse Drain Current IDP t = 10ms, Duty = 1% - 120 - A
Total Power Dissipation PD TC = 25°C - 210 - W
TC = 75°C - 130 - W
Junction Temperature TJ - - - 150 °C
Storage Temperature TSTG - -55 - 150 °C

Instructions for Use:

  1. Handling and Storage:

    • Store in a dry environment to prevent moisture damage.
    • Handle with care to avoid static discharge which can damage the MOSFET.
  2. Installation:

    • Ensure proper heat sinking if operating near maximum current or power dissipation limits.
    • Follow good soldering practices to avoid thermal shock to the device.
  3. Operation:

    • Operate within specified temperature ranges to ensure reliable performance.
    • Keep gate-source voltage (VGS) within safe limits to prevent gate oxide breakdown.
    • Avoid exceeding the maximum drain-source voltage (VDS(max)) as it can lead to device failure.
  4. Testing:

    • During testing, ensure that all parameters are within the specified limits provided in the table.
    • Use appropriate test equipment that does not exceed the device ratings.
  5. Safety Considerations:

    • Always use protective equipment when handling electrical components.
    • Disconnect power sources before making any changes to the circuit.
(For reference only)

 Inquiry - IRF3500