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Specifications
SKU: 8149228
| Parameter | Description |
|---|---|
| Device Name | K4B2G1646E-BCK0 |
| Type | DDR3 SDRAM |
| Density | 2 Gb (256M x 8) |
| Package | BGA (FBGA) |
| Voltage (Vcc) | 1.35V |
| Speed | 1600 Mbps |
| CAS Latency (CL) | 11 |
| Operating Temperature | -40°C to +85°C |
| Data Width | 8-bit |
| Bank Address Bits | 3 |
| Row Address Bits | 15 |
| Column Address Bits | 10 |
| Supply Voltage Range | VCC = 1.35V ± 0.135V |
| Refresh Rate | 8K refresh cycles per 64ms |
| Self-Refresh Exit Time | 70ns |
| Power Down Exit Time | 70ns |
Instructions for Use
- Power Supply: Ensure the supply voltage is set to 1.35V with a tolerance of ±0.135V.
- Initialization: After power-up, perform a reset and initialization sequence as specified in the JEDEC DDR3 standard.
- Refresh: Implement an 8K refresh cycle every 64 milliseconds to maintain data integrity.
- Timing Parameters: Adhere strictly to the timing parameters provided in the datasheet, especially for CAS latency and command intervals.
- Thermal Management: Operate within the temperature range of -40°C to +85°C. Consider heat sinks or cooling solutions if operating near the upper limit.
- Signal Integrity: Maintain proper signal integrity by following guidelines for PCB layout and termination resistors.
- Configuration: Configure the device according to your system's requirements using mode register settings.
For detailed information on specific operations and advanced configurations, refer to the full datasheet available from the manufacturer.
(For reference only)Inquiry - K4B2G1646E-BCK0
