Specifications
SKU: 7285715
MOSFET & IGBT Drivers, ON Semiconductor Power drivers for MOSFET and IGBT in low side, high side, and half-bridge circuits.
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | Operating | 2.7 | - | 5.5 | V |
| Output Voltage | VOUT | Fixed Output | - | 3.3 | - | V |
| Quiescent Current | IQ | VIN = 5V | - | 40 | - | μA |
| Dropout Voltage | VD | ILOAD = 100mA | - | 250 | - | mV |
| Load Regulation | ILOAD: 0 to 300mA | - | 0.5 | - | % | |
| Line Regulation | VIN: 2.7 to 5.5V | - | 0.1 | - | % | |
| Power Supply Rejection Ratio | PSRR | f = 1kHz | - | 65 | - | dB |
Instructions for Use:
Input Voltage (VIN):
- Ensure the input voltage is within the operating range of 2.7V to 5.5V.
Output Voltage (VOUT):
- The device provides a fixed output voltage of 3.3V. No external components are required for this setting.
Quiescent Current (IQ):
- The quiescent current is typically 40μA at an input voltage of 5V. This parameter is important for low-power applications.
Dropout Voltage (VD):
- At a load current of 100mA, the dropout voltage is typically 250mV. Ensure the input voltage exceeds the output voltage by at least this amount.
Load Regulation:
- The load regulation is typically 0.5% from no load to full load (0 to 300mA). This indicates how well the output voltage remains stable with varying loads.
Line Regulation:
- Line regulation is typically 0.1% over the input voltage range from 2.7V to 5.5V. This shows stability in output voltage with changes in input voltage.
Power Supply Rejection Ratio (PSRR):
- At a frequency of 1kHz, the PSRR is typically 65dB, indicating the device's ability to reject ripple and noise from the input supply.
Capacitors:
- For optimal performance, place a 1μF ceramic capacitor close to the input pin and a 1μF ceramic capacitor on the output pin. These capacitors help stabilize the regulator and reduce output noise.
Thermal Considerations:
- Ensure adequate heat dissipation if operating near maximum load conditions. The device can get warm under heavy loads, so consider thermal management techniques like heatsinking or airflow.
Layout:
- Follow good PCB layout practices to minimize parasitic inductance and resistance. Keep traces short and wide where possible, especially for power and ground connections.
Inquiry - NCP4304ADR2G