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ACS108-8SN-TR

Specifications

SKU: 12597194

BUY ACS108-8SN-TR https://www.utsource.net/itm/p/12597194.html

Parameter Description Value
Part Number Full part number ACS108-8SN-TR
Package Type Package type SOIC-8
Operating Voltage Supply voltage range 4.5V to 5.5V
Output Type Output signal type Analog
Bandwidth Frequency range 80 kHz
Current Range Measurable current range ±80A
Sensitivity Output sensitivity at nominal supply voltage 100 mV/A
Quiescent Current Supply current 12 mA (max)
Isolation Voltage Isolation between primary and secondary circuits 2.5 kVrms (1 min)
Temperature Range Operating temperature range -40°C to +85°C
Storage Temperature Storage temperature range -65°C to +150°C
Lead Finish Lead finish type SnPb (63/37)
RoHS Compliance RoHS compliance Non-RoHS

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage is within the specified range of 4.5V to 5.5V.
    • Connect the VCC pin to the positive supply and GND pin to the ground.
  2. Current Sensing:

    • Place the current-carrying conductor through the center hole of the sensor.
    • The current flowing through the conductor will generate a magnetic field, which is detected by the Hall effect sensor inside the device.
  3. Output Signal:

    • The output voltage (VOUT) is proportional to the sensed current.
    • For a nominal supply voltage of 5V, the sensitivity is 100 mV/A.
    • The output is centered around half the supply voltage (2.5V for 5V supply).
  4. Calibration:

    • If necessary, calibrate the output using a known current source to ensure accuracy.
    • Adjust any external circuitry to account for the offset and gain.
  5. Handling and Storage:

    • Handle the device with care to avoid damage to the leads and package.
    • Store the device in a dry environment within the specified storage temperature range.
  6. Safety Precautions:

    • Ensure proper isolation when handling high currents to prevent electrical shock.
    • Do not exceed the maximum operating voltage or current ratings to avoid damaging the device.
  7. Mounting:

    • Mount the device on a PCB using standard soldering techniques.
    • Ensure proper thermal management if operating at high temperatures or currents.
  8. Testing:

    • Test the device in a controlled environment to verify its performance before integrating it into the final application.
(For reference only)

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