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UPD71051L-10

Specifications

SKU: 12381190

BUY UPD71051L-10 https://www.utsource.net/itm/p/12381190.html

Parameter Description Min Typ Max Unit
Supply Voltage (Vcc) Operating supply voltage 4.75 5.0 5.25 V
Output Current (Iout) Maximum output current per pin - 16 - mA
Power Dissipation (Pd) Total power dissipation - 380 - mW
Operating Temperature (Toper) Range of operating temperature -40 - 85 °C
Storage Temperature (Tstg) Range of storage temperature -55 - 150 °C
Input Voltage (Vin) Maximum input voltage 0 - Vcc + 0.5 V
Output Voltage (Voh) High-level output voltage - Vcc - 0.5 - V
Output Voltage (Vol) Low-level output voltage - 0.5 - V
Propagation Delay (tpd) Typical propagation delay time - 12 - ns
Rise Time (tr) Output rise time - 4.5 - ns
Fall Time (tf) Output fall time - 4.5 - ns

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the range of 4.75V to 5.25V to avoid damage to the device.
  2. Output Current:

    • Do not exceed 16mA per output pin to prevent overheating and potential failure.
  3. Power Dissipation:

    • The total power dissipation should not exceed 380mW. Use appropriate heat sinking if necessary.
  4. Operating Temperature:

    • The device can operate within a temperature range of -40°C to 85°C. Avoid operating outside this range to ensure reliable performance.
  5. Storage Temperature:

    • Store the device in an environment with a temperature range of -55°C to 150°C to prevent degradation.
  6. Input Voltage:

    • The maximum input voltage should not exceed Vcc + 0.5V to avoid damaging the input protection diodes.
  7. Output Voltage Levels:

    • High-level output voltage (Voh) should be at least Vcc - 0.5V.
    • Low-level output voltage (Vol) should not exceed 0.5V.
  8. Propagation Delay:

    • The typical propagation delay time is 12ns. This is the time it takes for the output to respond to a change in input.
  9. Rise and Fall Times:

    • The typical rise and fall times are 4.5ns each. These values are important for timing considerations in high-speed circuits.
  10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use proper anti-static precautions when handling and installing the device.
  11. Mounting:

    • Ensure the device is securely mounted on the PCB to prevent mechanical stress.
    • Follow the recommended soldering profile to avoid thermal damage during assembly.
  12. Testing:

    • Test the device under normal operating conditions to ensure it meets the specified parameters.
    • Perform functional tests to verify correct operation before deploying in a final application.
(For reference only)

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