Specifications
SKU: 12381190
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (Vcc) | Operating supply voltage | 4.75 | 5.0 | 5.25 | V |
| Output Current (Iout) | Maximum output current per pin | - | 16 | - | mA |
| Power Dissipation (Pd) | Total power dissipation | - | 380 | - | mW |
| Operating Temperature (Toper) | Range of operating temperature | -40 | - | 85 | °C |
| Storage Temperature (Tstg) | Range of storage temperature | -55 | - | 150 | °C |
| Input Voltage (Vin) | Maximum input voltage | 0 | - | Vcc + 0.5 | V |
| Output Voltage (Voh) | High-level output voltage | - | Vcc - 0.5 | - | V |
| Output Voltage (Vol) | Low-level output voltage | - | 0.5 | - | V |
| Propagation Delay (tpd) | Typical propagation delay time | - | 12 | - | ns |
| Rise Time (tr) | Output rise time | - | 4.5 | - | ns |
| Fall Time (tf) | Output fall time | - | 4.5 | - | ns |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (Vcc) is within the range of 4.75V to 5.25V to avoid damage to the device.
Output Current:
- Do not exceed 16mA per output pin to prevent overheating and potential failure.
Power Dissipation:
- The total power dissipation should not exceed 380mW. Use appropriate heat sinking if necessary.
Operating Temperature:
- The device can operate within a temperature range of -40°C to 85°C. Avoid operating outside this range to ensure reliable performance.
Storage Temperature:
- Store the device in an environment with a temperature range of -55°C to 150°C to prevent degradation.
Input Voltage:
- The maximum input voltage should not exceed Vcc + 0.5V to avoid damaging the input protection diodes.
Output Voltage Levels:
- High-level output voltage (Voh) should be at least Vcc - 0.5V.
- Low-level output voltage (Vol) should not exceed 0.5V.
Propagation Delay:
- The typical propagation delay time is 12ns. This is the time it takes for the output to respond to a change in input.
Rise and Fall Times:
- The typical rise and fall times are 4.5ns each. These values are important for timing considerations in high-speed circuits.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Use proper anti-static precautions when handling and installing the device.
Mounting:
- Ensure the device is securely mounted on the PCB to prevent mechanical stress.
- Follow the recommended soldering profile to avoid thermal damage during assembly.
Testing:
- Test the device under normal operating conditions to ensure it meets the specified parameters.
- Perform functional tests to verify correct operation before deploying in a final application.
Inquiry - UPD71051L-10