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DRV135UAG4

Specifications

SKU: 11700202

BUY DRV135UAG4 https://www.utsource.net/itm/p/11700202.html
IC LINE DRIVER 8SOIC
Parameter Symbol Min Typical Max Unit Description
Supply Voltage VDD 2.7 5.5 V Operating supply voltage range
Quiescent Current IQ 100 μA Supply current with no load
Output Current IOUT 250 500 mA Maximum continuous output current
Output Voltage VOUT V Output voltage, depends on input voltage and load
Enable Input Voltage VEN 0.8 2.0 V Threshold for enabling the device
Shutdown Current ISD 1.0 μA Supply current when the device is disabled
Thermal Shutdown TSD 160 °C Temperature at which the device shuts down to prevent damage
Operating Temperature TOPR -40 125 °C Ambient temperature range for normal operation
Storage Temperature TSTG -65 150 °C Temperature range for storage

Instructions

  1. Power Supply:

    • Connect the VDD pin to a power supply within the range of 2.7V to 5.5V.
    • Ensure that the power supply is stable and can provide sufficient current to meet the maximum output current requirements.
  2. Enable Pin (EN):

    • Apply a voltage greater than 0.8V to the EN pin to enable the device.
    • To disable the device, apply a voltage less than 0.8V or leave the EN pin floating.
  3. Output Configuration:

    • Connect the load to the OUT pin.
    • Ensure that the load does not exceed the maximum continuous output current of 500mA.
  4. Thermal Management:

    • Monitor the operating temperature to ensure it does not exceed 125°C.
    • If the device reaches the thermal shutdown temperature (160°C), it will automatically shut down to prevent damage.
  5. Storage:

    • Store the device in an environment where the temperature ranges from -65°C to 150°C.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use proper ESD protection measures during handling and installation.
  7. Testing:

    • Before integrating the device into a final application, perform thorough testing to ensure it meets the required performance specifications.
  8. Layout Considerations:

    • Place the device close to the load to minimize trace resistance and inductance.
    • Use appropriate decoupling capacitors near the VDD pin to filter out noise and stabilize the power supply.
(For reference only)

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